watching-guy wrote:
不論他AMD推出什麼樣的GPU, APU, CPU, 理論上都是優先給中國的通富微電承攬. 中國被科技制裁, 每一種先進設備更新都會被緊盯, 追不上台灣封裝技術的進步.
也因此, AMD產品推出的速度, 永遠都比nVidia慢很多. 而且良率與效能, 應該也被打了折扣.
外殼/小晶片「外部封裝」跟小晶片「內部」的2.5D 封裝，那是兩回事吧。
這種外殼的東西，在哪裡做不是做，能延遲多久？
這個等級的工藝在「成本」跟「出貨時程」上的佔比很低。
更不用說什麼效能良率的問題。根本毫無關係。
這種低階封裝廠，AMD 在馬來西亞也有，到時候移過去做就可以了。
AMD set to Open Manufacturing Plant in Malaysia in Early 2023
by TheLostSwede Jun 14th, 2022 08:17 Discuss (24 Comments)
AMD's Malaysian joint venture, TF-AMD Microelectronics is in the middle of the construction of a US$452 million manufacturing plant on the island of Penang off the west coast of Malaysia. The facility itself is said to cover 139,000 square metres and is said to create some 3,000 jobs related to advanced semiconductor engineering. The new plant will bring TF-AMD's total manufacturing space in Penang to 210,000 square metres, as the company already has a prior facility on the island.
The plant will allow AMD to expand the chip packaging side of its business, something that is going to be key for many of its future products, considering AMD appears to be focusing on manufacturing a wider range of chips that are made up from multiple chiplets. The TF in the name stands for TongFu, which is a Chinese IC assembly and testing company that AMD has partnered up with in Malaysia. The current plant does everything from wafer sorting to wafer level chip scale packaging to final testing and AMD chi
